Thermal conductive paste 1gram AG silver 001688 BOWI

Product description

AG SILVER thermal conductive paste contains silver compounds. The product is also distinguished by its low thermal impedance. Thermal conductivity is much higher than that of typical carbon-silicon compounds. It is worth covering with it the micro gaps between heatsinks and CPUs, GPUs or other components.

AG Silver paste is also useful for heat transfer from tube condensers to heat exchangers inside solar collectors. The usefulness of the product is confirmed by the RoHS standard, in accordance with which it was manufactured. The product is compliant with the ROHS directive.

Product parameters:

• color: silver
• thermal conductivity: > 3.8 W/mk
• thermal impedance: < 0.087 °C in2/W
• specific gravity: >1.7 g/cm3
• evaporation: < 0.001
• leakage: < 0.05
• dielectric constant: > 5.1
• operating temperature: -30 ~300 °C
• thermal resistance: -50 ~340 °C

Industry:

• electronics
• IT